Discover 169 technologies from leading innovators around the world.
Metering system-on-chip that Vervesemi describes as an analog front end integrated with a microcontroller for single-phase energy measurement.
IndustrialEnergyView Technology
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrial+2View Technology
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
AI & HPCData Center+1View Technology
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
AI & HPCIndustrial+2View Technology
Elmos automotive motor-control ICs are mixed-signal BLDC driver chips, parked in Design & IP because Analog / Mixed Signal does not exist.
AutomotiveIndustrialView Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPC+2View Technology
ESP32 is Espressif’s Wi-Fi and Bluetooth SoC platform, not a module SKU catalog and not processor IP.
IndustrialConsumer Electronics+1View Technology
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunications+1View Technology
SkyWater RH90 is a radiation-hardened 90 nm CMOS foundry process, not processor IP and not a packaged rad-hard MCU.
IndustrialAerospace & DefenseView Technology
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
AutomotiveIndustrial+1View Technology
Valens Stello VS3000 is high-speed connectivity silicon for AVoIP, not processor IP and not a finished camera.
IndustrialConsumer Electronics+1View Technology
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
AutomotiveIndustrial+2View Technology
Weebit ReRAM is embedded resistive-RAM IP, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
AutomotiveAI & HPC+1View Technology
SG Micro’s analog and mixed-signal platform covers amplifiers, converters and precision analog ICs, parked in Design & IP because Analog / Mixed Signal does not yet exist.
AutomotiveIndustrial+1View Technology
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
AutomotiveIndustrial+2View Technology
San’an LED is a compound-semiconductor epitaxy and chip platform, not a packaged lamp catalog.
AutomotiveIndustrial+1View Technology
Rohm EcoGaN is a gallium-nitride power-device family, not a silicon MOSFET catalog.
AutomotiveData Center+2View Technology
GigaDevice GD25 and GD55 are SPI NOR flash product families for code storage, not a discrete DRAM or NAND catalog.
AutomotiveIndustrial+2View Technology
GalaxyCore GalaxyCell 2.0 is a CMOS image-sensor pixel-process platform using FPPI Plus and BDTI.
AutomotiveIndustrial+1View Technology
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
AutomotiveAI & HPC+2View Technology
Silergy’s integrated PMIC platform covers multi-rail power-management ICs, not discrete MOSFETs.
AutomotiveData Center+2View Technology
Semtech LoRa is a long-range, low-power IoT radio platform, not a cellular modem and not a generic MCU.
IndustrialTelecommunications+2View Technology
Silicon Labs Series 3 is a next-generation wireless SoC platform, with SiXG302 sampling described as 2026.
IndustrialConsumer Electronics+2View Technology
