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27 results for Materials & Substrates
Wolfspeed conductive silicon carbide substrates and SiC epitaxy materials offered for power-electronics device manufacturing.
Austria·1 technology
IC-substrate company that publishes high-density build-up substrates used to connect advanced processors to system boards.
United States·1 technology
Compound-semiconductor materials company that publishes VGF substrates for III-V devices.
Materials and compound-semiconductor company that publishes III-V epitaxial wafer platforms for photonic and RF devices.
Process-materials company that publishes advanced deposition materials and contamination-control products for semiconductor manufacturing.
Taiwan·1 technology
Silicon-wafer company that publishes annealed, epitaxial, SOI and diffusion wafers.
Japan·1 technology
Ceramics company that publishes silicon-nitride substrate families for power modules and other high-temperature electronics.
Photomask company that publishes advanced IC photomasks used in semiconductor lithography.
United Kingdom·1 technology
Company that publishes flexible semiconductor platform technology using metal-oxide thin-film transistors on flexible substrates for mixed-signal integrated circuits.
Electronics-materials company that publishes CMP pad platforms, including Emblem.
Silicon-wafer company that publishes advanced semiconductor wafer platforms.
South Korea·3 technologies
Semiconductor company that publishes memory, foundry process and image-sensor technologies, including HBM, V10 BV-NAND and GAA MBCFET process platforms.
