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Silicon Showcase
CompaniesApplicationsTechnology AreasAbout
Submit Technology
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Silicon Showcase

Silicon Showcase™ is the global directory of semiconductor technologies, platforms and innovations from around the world.

  • Technologies
  • Technology Signals
  • Companies
  • Applications
  • Technology Areas
  • About Us
  • How It Works
  • Submit Technology
  • Contact Us
  • Privacy Policy
  • Terms of Use
  • Disclaimer

Explore

  • Technologies
  • Technology Signals
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  • Applications
  • Technology Areas

About

  • About Us
  • How It Works
  • Submit Technology
  • Contact Us

Legal

  • Privacy Policy
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  • Disclaimer

© 2026 Silicon Showcase™. All rights reserved.

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28 results for Design & IP

All54Technologies26Organizations28

Organizations (28)

Advanced Micro Devices

United States·2 technologies

Semiconductor company that publishes chiplet CPU architectures and 3D cache stacking, including Infinity Fabric and 3D V-Cache.

AI & HPCConsumer ElectronicsData Center+1View Profile

Alchip Technologies

Taiwan·1 technology

High-performance ASIC company that publishes advanced-node design platforms, including a 2nm design methodology for HPC and AI ASICs.

AI & HPCData CenterTelecommunications+1View Profile

Ambiq

United States·1 technology

Ultra-low-power MCU company that publishes subthreshold processing technology, including SPOT.

AI & HPCConsumer ElectronicsIoT+1View Profile

Analog Devices

United States·1 technology

Analog and mixed-signal semiconductor company that publishes high-speed mixed-signal front-end platforms, including MxFE.

Aerospace & DefenseIndustrialTelecommunications+1View Profile

Arm

United Kingdom·1 technology

Semiconductor IP and architecture company that publishes processor, system and chiplet-related architecture specifications used in SoC and multi-die design.

AI & HPCAutomotiveData Center+1View Profile

Arteris

United States·1 technology

Semiconductor IP company that publishes on-chip interconnect IP, including FlexNoC.

AI & HPCAutomotiveData Center+1View Profile

CEVA

United States·1 technology

Processor-IP company that publishes DSP and neural-processing IP, including CEVA-NeuPro-Nano.

AI & HPCConsumer ElectronicsIoT+1View Profile

Cadence Design Systems

United States·1 technology

Electronic design automation company that publishes multi-die design software, including the Integrity 3D-IC platform for planning, implementation and analysis of stacked-die systems.

AI & HPCAutomotiveData Center+1View Profile

Cirrus Logic

United States·1 technology

Mixed-signal company that publishes Halo Core haptic-driver platforms.

AutomotiveConsumer ElectronicsDesign & IP+1View Profile

Elmos Semiconductor

Germany·1 technology

Automotive mixed-signal semiconductor company that publishes motor-control ICs, including brushless DC motor drivers.

AutomotiveIndustrialDesign & IP+1View Profile

Global Unichip

Taiwan·1 technology

ASIC company that publishes 2.5D/3D multi-die advanced-packaging design platforms.

AI & HPCData CenterTelecommunications+1View Profile

GlobalFoundries

United States·1 technology

Foundry company that publishes FD-SOI process platforms, including 22FDX for low-power, RF, automotive and IoT designs.

AutomotiveConsumer ElectronicsIoT+1View Profile
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