Discover 169 technologies from leading innovators around the world.
Powerchip 3D AI Foundry is a wafer-on-wafer logic/memory stacking foundry offering, parked in Advanced Packaging because Foundry / Process does not yet exist.
AutomotiveAI & HPCData CenterView Technology
Vanguard BCD, UHV and SOI are specialty foundry process platforms for power management, parked in Power pending Foundry / Process.
AutomotiveIndustrialConsumer Electronics+1View Technology
GlobalWafers Silicon Wafers are the company's silicon starting substrates, including annealed, epitaxial, SOI and diffusion wafers.
AutomotiveAI & HPCIndustrial+1View Technology
eMemory NeoFuse is anti-fuse embedded OTP/PMTP silicon IP for logic process nodes, not a discrete memory product.
AutomotiveAI & HPCConsumer Electronics+1View Technology
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
AutomotiveConsumer ElectronicsTelecommunications+1View Technology
Nanya’s second-generation 10nm-class DRAM is the company’s current DRAM process generation, described in official investor communications.
AutomotiveData CenterConsumer ElectronicsView Technology
