Wafer fabrication

Foundries, process nodes and specialty processes.

SearchProviderAll providersGlobalFoundriesHua Hong SemiconductorMACOM Technology SolutionsPowerchip Semiconductor ManufacturingQorvoSMICSamsung SemiconductorSkyWater TechnologyTower SemiconductorUnited Microelectronics CorporationVanguard International SemiconductorSolution typeAll solution typesNot statedCapabilityAll capabilities22 nm fully depleted SOI transistor on an insulating layer22nm ultra-low-power / ultra-low-leakage logic process28nm high-k metal-gate logic foundry process3D wafer-on-wafer foundry ecosystemAutomotive, industrial and consumer siliconBCD, UHV and SOI foundry processesComplementary to leading-edge GAA FinFET nodes rather than a duplicateCompound-semiconductor foundry rather than a catalog MMICDocumented in SMIC newsroom coverageFirst described in 3 nm foundry production in 2022Foundry process rather than design IPGaAs and GaN foundry processesGaN and GaAs foundry servicesGate-All-Around nanosheet transistors (MBCFET) replacing FinFETNot a Connectivity & RF FEM listingNot a discrete DRAM product listingNot a discrete power-device catalogNot a packaged rad-hard MCU listingNot a separate Samsung Foundry organization rowNot separate listings for other GlobalFoundries nodes in this expansionOfficial platform targeting low-power, RF, automotive and IoT designsParked in Advanced Packaging pending Foundry / ProcessParked in Design & IP pending Foundry / ProcessParked in Photonics pending a Foundry / Process areaParked in Power pending Foundry / ProcessProcess platform for mobile, HPC, AI and automotive designsRadiation-hardened 90 nm CMOS foundry processSiGe heterojunction bipolar transistors with CMOSSpecialty analog and RF foundry processSpecialty foundry embedded non-volatile memory processesSpecialty foundry platform for IoT and mixed-signal SoCsTemporary Design & IP mapping pending a foundry areaTemporary Design & IP mapping pending a foundry or analog area

Apply

Showing 11 of 11 published solutions.

View shortlist

Foundry / Process

22ULP/ULL

UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.

United Microelectronics CorporationTaiwanView Technology

Providers

Companies shown here publish a technology mapped to this page. Contact is for general enquiries, not a compatibility claim.

• United Microelectronics CorporationTaiwan
• SMICChina
• Powerchip Semiconductor ManufacturingTaiwan
• Vanguard International SemiconductorTaiwan
• QorvoUnited States
• Hua Hong SemiconductorChina
• GlobalFoundriesUnited States
• MACOM Technology SolutionsUnited States
• SkyWater TechnologyUnited States

No related reports, source-backed events, or webinars are linked to the published records in this view.